Enhancement of copper adhesion on alumina induced by ion-beam mixing

Author:

Fuchs G.,Abonneau E.,Treilleux M.,Perez A.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Reference8 articles.

1. J. E. E. BAGLIN, in ?Ion Beam Modification of Insulators?, edited by P. Mazzoldi and G. W. Arnold (Elsevier, Amsterdam, 1987) p. 585.

2. J. E. E. BAGLIN and G. J. CLARK,Nucl. Instrum. Meth. B7/8 (1985) 881.

3. G. FUCHS, E. ABONNEAU, M. TREILLEUX and A. PEREZ,Mater. Sci. Eng. A109 (1989) 83.

4. J. F. ZIEGLER, J. P. BIERSACK and U. LITTMARK, ?The Stopping and Range of Ions in Solids?, Vol. 1 (Pergamon Press, New York, 1984).

5. G. FUCHS, E. ABONNEAU, M. TREILLEUX and A. PEREZ,Nucl. Instrum. Meth. (1990) in press.

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1. Adhesion-enhanced thick copper film deposition on aluminum oxide by an Ion-beam-mixed Al seed layer;Journal of the Korean Physical Society;2012-07

2. Conversion Electron Mössbauer Analysis of Radiation Effects Induced in Thin Metallic Films;Mössbauer Spectroscopy Applied to Magnetism and Materials Science;1993

3. Ion beam mixing of metal-ceramic interfaces;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1992-03

4. Microstructural and chemical characterization of ion beam mixed Fe/Al2O3 interface; effect on adhesion enhancement;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1991-07

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