Thermal-aware routing algorithm in partially connected 3D NoC with dynamic availability for elevators-Reference-Cited by-同舟云学术

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Thermal-aware routing algorithm in partially connected 3D NoC with dynamic availability for elevators

Published:2022-08-03 Issue: Volume: Page:
ISSN:1868-5137
Container-title:Journal of Ambient Intelligence and Humanized Computing
language:en
Short-container-title:J Ambient Intell Human Comput

Author:

Nezarat Majid,Shahhoseini Hadi Shahriar^ORCID,Momeni Masoomeh

Publisher

Springer Science and Business Media LLC

Subject

General Computer Science

Link

https://link.springer.com/content/pdf/10.1007/s12652-022-04345-3.pdf

Reference16 articles.

1. Catania V, Mineo A, Monteleone S, Palesi M, Patti D (2015) Noxim: an open, extensible and cycle-accurate network on chip simulator. In: 2015 IEEE 26th international conference on application-specific systems, architectures and processors (ASAP), pp 162–163‏

2. Cui Y, Prabhakar S, Zhao H, Mohanty S, Fang J (2020) A low-cost conflict-free NoC architecture for heterogeneous multicore systems. In: 2020 IEEE computer society annual symposium on VLSI (ISVLSI), pp 300–305

3. Dash R, Majumdar A, Pangracious V, Turuk AK, Risco-Martin JL (2018) ATAR: an adaptive thermal-aware routing algorithm for 3-D network-on-chip systems. IEEE Trans Compon Packag Manuf Technol 8(12):2122–2129

4. Dubois F, Sheibanyrad A, Petrot F, Bahmani M (2011) Elevator-first: a deadlock-free distributed routing algorithm for vertically partially connected 3d-nocs. IEEE Trans Comput 62(3):609–615

5. Indragandhi K, Jawahar PK (2021) Core performance based packet priority router for NoC-based heterogeneous multicore processor. In: Satapathy SC et al (eds) Intelligent system design. Springer, Singapore, pp 389–397

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cluster-Based Thermal-Aware Mapping for 3D-NoC-Based NASH Neuromorphic System;2024 IEEE International Conference on Advanced Systems and Emergent Technologies (IC_ASET);2024-04-27

2. TCAR: Thermal and Congestion-Aware Routing Algorithm in a Partially Connected 3D Network on Chip;2022 12th International Conference on Computer and Knowledge Engineering (ICCKE);2022-11-17

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