Parameter-dependent oxidation of physically sputtered Cu and the related fabrication of Cu-based semiconductor films with metallic resistivity
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s40843-016-0125-y.pdf
Reference18 articles.
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3. Chan KY, Tou TY, Teo BS. Effects of substrate temperature on electrical and structural properties of copper thin films. Microelectron J, 2006, 37: 930–937
4. Choi HM, Choi SK, Aderson O, et al. Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering. Thin Solid Films, 2000, 358: 202–205
5. Balendhran S, Deng J, Ou JZ, et al. Enhanced charge carrier mobility in two-dimensional high dielectric molybdenum oxide. Adv Mater, 2013, 25: 109–114
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