Details on the Formation of Ti2Cu3 in the Ag-Cu-Ti System in the Temperature Range 790 to 860 °C-Reference-Cited by-同舟云学术

Details on the Formation of Ti2Cu3 in the Ag-Cu-Ti System in the Temperature Range 790 to 860 °C

Published:2008-02-07 Issue:2 Volume:29 Page:156-162
ISSN:1547-7037
Container-title:Journal of Phase Equilibria and Diffusion
language:en
Short-container-title:J Phs Eqil and Diff

Author:

Andrieux J.,Dezellus O.,Bosselet F.,Sacerdote-Peronnet M.,Sigala C.,Chiriac R.,Viala J. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11669-008-9247-6.pdf

Reference18 articles.

1. N. Eustathopoulos, M.G. Nicholas, and B. Drevet, Wettability at High Temperature, Pergamon, 1999, p 348-384

2. M.F. Wu, Z.S. Yu, C.Y. Jiang and C. Liang, Growth Mechanism of Compound at Interface of Ti-6Al-4V Joint Brazed with 72Ag-28Cu Filler Alloy, Mater. Sci. Technol., 2002, 18, p 1314-1316

3. H.Y. Chan, D.W. Liaw and R.K. Shiue, Microstructural Evolution of Brazing Ti-6Al-4V and TZM Using Silver-Based Braze Alloy, Mater. Lett., 2004, 58, p 1141-1146

4. J. Andrieux, O. Dezellus, F. Bosselet, M. Sacerdote-Peronnet, and J.C. Viala, “Reactivity of the Ag-Cu28 Braze Alloy with Titanium,” XXXII JEEP, Rouen, France, April 2006

5. K. Schubert, On the Constitution of the Ti-Cu and Ti-Ag Systems, Z. Metallkd., 1965, 56, p 197-198

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