Author:
Attari Vahid,Arroyave Raymundo
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Condensed Matter Physics
Reference29 articles.
1. M.L. Huang and F. Yang, Size Effect Model on Kinetics of Interfacial Reaction Between Sn-xAg-yCu Solders and Cu Substrate, Sci. Rep., 2014, 4, p 7117
2. H.-Y. Hsiao, C.-M. Liu, H. Lin, T.-C. Liu, C.-L. Lu, Y.-S. Huang, C. Chen, and K.N. Tu, Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper, Science, 2012, 336, p 1007-1010
3. K.N. Tu, Reliability Challenges in 3D IC Packaging Technology, Microelectron. Reliab., 2011, 51, p 517-523
4. M. Ohyama, M. Nimura, J. Mizuno, S. Shoji, T. Nonaka, Y. Shinba, and A. Shigetou, Evaluation of Hybrid Bonding Technology of Single-Micron Pitch with Planar Structure for 3D Interconnection. Microelectron. Reliab.
5. K.N. Tu and T. Tian, Metallurgical Challenges in Microelectronic 3D IC Packaging Technology for Future Consumer Electronic Products, Sci. China Technol. Sci., 2013, 56, p 1740-1748
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献