On the mechanism of electroless plating. II. One mechanism for different reductants-Reference-Cited by-同舟云学术

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On the mechanism of electroless plating. II. One mechanism for different reductants

Published:1981-05 Issue:3 Volume:11 Page:395-400
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Van Den Meerakker J. E. A. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00613960.pdf

Reference69 articles.

1. M. Paunovic,Plating 55 (1968) 1161.

2. A. V. Gorodyskii, I. A. Stepanova and A. I. Zayats,Sov. Electrochem. 9 (1973) 312.

3. I. Ohno,Surf. Technol. 4 (1976) 515.

4. H. Zeilmaker and E. Barendrecht,Proc. 9th World Congress on Metal Finishing, Amsterdam (October 1976).

5. Y. Okinaka,J. Electrochem. Soc. 120 (1973) 739.

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