Effect of environmental conditions and geometric parameters on the squeeze film damping in RF-MEMS switches
Author:
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Link
http://link.springer.com/content/pdf/10.1007/s10470-018-1283-5.pdf
Reference28 articles.
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2. Veijola, T., et al. (2009). Experimental validation of compact damping models of perforated MEMS devices. Microsystem Technologies, 15(8), 1121–1128.
3. Yang, W., et al. (2016). A novel approach to the analysis of squeezed-film air damping in microelectromechanical systems. Journal of Micromechanics and Microengineering, 27(1), 015012.
4. Al-Cheikh, N., et al. (2016). Influence of squeeze film damping on the higher-order modes of clamped–clamped microbeams. Journal of Micromechanics and Microengineering, 26(6), 065014.
5. Wang, W., et al. (2016). Dynamic behavior of perforated parallel-plate actuator under squeeze film damping effect. Microsystem Technologies, 23(2), 411–419.
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