Interfacial IMC Growth and Nanomechanical Characterizations of Solder in Sn-16Sb/Cu Joints during Solid-state Aging
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11595-019-2180-1.pdf
Reference38 articles.
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3. Chen S W, Chen P Y, Wang C H. Lowering of Sn-Sb Alloy Melting Points Caused by Substrate Dissolution[J]. J. Electron. Mater., 2006, 35(11): 1982–1985
4. Jang J W, Kim P G, Tu K N, et al. High-temperature Lead-free SnSb Solders: Wetting Reactions on Cu Foils and Phased-in Cu-Cr Thin Films[J]. J. Mater. Res., 1999 14(10): 3895–3900
5. Kim J H, Jeong S W, Lee H M. Interfacial Microstructure and Joint Strength of Sn-3.5Ag-X (X= Cu, In, Ni) Solder Joint[J]. Mater. Trans., 2002, 43(8): 1873–1878
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