Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys-Reference-Cited by-同舟云学术

Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys

Published:2006-05 Issue:5 Volume:35 Page:1095-1103
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Xiao Weimin,Shi Yaowu,Lei Yongping,Xia Zhidong,Guo Fu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02692572.pdf

Reference20 articles.

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2. Z.D. Xia, Y.P. Lei, Y.W. Shi,Electron. Process Technol. 23, 185 (2002).

3. K. Suganuma,Curr. Opin. Solid State Mater. Sci. 5, 55 (2001).

4. B. Richards and K. Nimmo,An Analysis of the Current Status of Lead-Free Soldering-Update 2000 (London, U.K.: Department of Trade and Industry, 2000).

5. D.R. Frear,Electron. Inf. Technol. 118, 81 (2001).

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