Failure Mechanism and Analysis Diagnosis of LED-Reference-Cited by-同舟云学术

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Failure Mechanism and Analysis Diagnosis of LED

Published:2022-01-24 Issue:1 Volume:37 Page:195-206
ISSN:0970-3950
Container-title:MAPAN
language:en
Short-container-title:MAPAN

Author:

Yao Hao-wei,Li You-xin,Zhang Yang,Lv Zhong-bin,Wei Xiao-ge,Song Huai-tao,Qin Heng-jie,Zou Jin-lin

Funder

Science and Technology Projects Funded by State Grid Corporation of China

Henan Province Key R&D and Promotion Special Project

Publisher

Springer Science and Business Media LLC

Subject

Physics and Astronomy (miscellaneous)

Link

https://link.springer.com/content/pdf/10.1007/s12647-021-00518-1.pdf

Reference15 articles.

1. GJB548-96 Test methods and procedures for microelectronic devices, China Planning Press, China, 1996.

2. J. Dong and A. Pandharipande, Lumen Depreciation Diagnosis in Modulated LED Lighting Systems, in IEEE Photonics Technology Letters, vol. 25, no. 15, pp. 1466–1469, Aug.1, 2013. https://doi.org/10.1109/LPT.2013.2267591

3. Y. Zhou, Failure Mechanism of Gold-Plated Contacts in Mobile Phones Under Dust Contamination Jointing With Micromotion Condition. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5 (2015) 337–344. https://doi.org/10.1109/TCPMT.2015.2393374.

4. L. Cui, J. Huang and F. Zhang, Quantitative and Localization Diagnosis of a Defective Ball Bearing Based on Vertical-Horizontal Synchronization Signal Analysis. IEEE Transactions on Industrial Electronics, 64 (2017) 8695–8706. https://doi.org/10.1109/TIE.2017.2698359.

5. S. Zhang, J.H. Park and K.W. Paik, Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (2016) 1820–1826. https://doi.org/10.1109/TCPMT.2016.2619878.

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1. Experimental investigation of polymeric straight fin heat sink for low power LED;Interactions;2024-08-29

2. Failure Analysis of Open Circuit for the LEDs of Epoxy Resin Encapsulation;2023 6th International Conference on Electronics Technology (ICET);2023-05-12

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