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Effect of residual stress on RF MEMS switch

  • Published:2011-10-13 Issue:12 Volume:17 Page:1739-1745
  • ISSN:0946-7076
  • Container-title:Microsystem Technologies
  • language:en
  • Short-container-title:Microsyst Technol

Author:

Dutta Shankar,Imran Mohd,Pal Ramjay,Jain K. K.,Chatterjee R.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analytical and Experimental Study of Fabrication Process Induced Stress on Pull-in Behaviour of Fixed-Fixed Beam RF-MEMS Switches;2024 IEEE Space, Aerospace and Defence Conference (SPACE);2024-07-22

2. Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

3. The Strong Effect of NiCr Adhesion Layers in Surface Micromachined MEMS Sensors;IEEE Sensors Letters;2023-10

4. Molecular Dynamics Study on Mechanical Stress Formation during Polycrystalline Cr-Film Growth;Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques;2022-12

5. Electromechanical modelling and stress analysis of RF MEMS capacitive shunt switch;Microsystem Technologies;2022-08-21
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