Author:
Lodhi Mangal Singh,Sheorey Tanuja,Dutta Goutam
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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1. Thermal Management of Electronic packages using Al2O3/water Nanofluid as Coolant in microchannel heat sink;Proceeding of Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India;2024