Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Biernath R, Soane D (1989) Characterization of stresses in polymer films for microelectronics applications. In: Lupinski J, Moore R (eds) Polymeric materials for electronics packaging and interconnection. ACS, Washington, pp 356–374
2. Guckel H, and Burns DW (1984) Planar processed polysilicon sealed cavities for pressure transducer arrays. International Electron Devices Meeting (IEDM), 223–225
3. Jourdain A, Ziad H, Moor PD, Tilmans HAC (2003) Wafer-scale 0-level packaging of (RF-) MEMS devices using BCB. IEEE Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Mandelieu-La Napoule, France, 239–244
4. Kim K, Kim J, Hwang G, Baek C, Kim Y (2006) Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer. J Micromech Microeng 16(1):150–156
5. Kim J, Seok S, Rolland N (2012) Low-temperature, low-loss zero level packaging technique for RF applications using a photopatternable dry Film. J Micromech Microeng. doi: 10.1088/0960-1317/22/6/065032
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