Molecular scale analysis of dry sliding copper asperities-Reference-Cited by-同舟云学术

Molecular scale analysis of dry sliding copper asperities

Published:2014-07-24 Issue:4 Volume:5 Page:469-480
ISSN:2190-5509
Container-title:Applied Nanoscience
language:en
Short-container-title:Appl Nanosci

Author:

Vadgama Bhavin N.,Jackson Robert L.,Harris Daniel K.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Cell Biology,Physical and Theoretical Chemistry,Materials Science (miscellaneous),Atomic and Molecular Physics, and Optics,Biotechnology

Link

http://link.springer.com/article/10.1007/s13204-014-0339-9/fulltext.html

Reference45 articles.

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3. Barriga J, Fernandez-Diaz B, Juarros A, Ahmed SI-U, Arana JL (2007) Microtribological analysis of gold and copper contacts. Tribol Int 40:1526–1530

4. Bhushan B (2007) Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices. Microelectron Eng 84:387–412

5. Blau PJ (1991) Scale effects in steady-state friction. Tribol Trans 34(3):335–342

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1. Molecular dynamics simulation of dry sliding between non-Gaussian copper rough surfaces;Applied Surface Science;2024-08

2. In situ SEM side observation of asperity behavior during sliding contact;Extreme Mechanics Letters;2024-06

3. Discussion: “Modeling of Flash Temperature for Elastic Sliding Contact of Single Micro-Asperity Pair” (Wu, Z., Zhang, Y., Xu, Y., Jie, D., and Jackson, R. L., 2024, ASME J. Tribol., 146(1), p. 011702);Journal of Tribology;2024-02-02

4. Friction and wear study of metallic contacts under dry sliding conditions: A molecular dynamics simulation-based approach;Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology;2023-12-15

5. A Stress-State-Dependent Sliding Wear Model for Micro-Scale Contacts;Journal of Tribology;2023-08-16