Parameter optimization of etching process for a LGP stamper
Author:
Publisher
Springer Science and Business Media LLC
Subject
Artificial Intelligence,Software
Link
http://link.springer.com/content/pdf/10.1007/s00521-012-1103-2.pdf
Reference12 articles.
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3. Kim MJ, Kim DK, Lee SG, Kown OD (2004) Wet etching fabrication of photonic quantum ring laser. J Appl Phys 96:4742
4. Wilke N, Mulcahy A, Ye SR, Morrissey A (2005) Process optimization and characterization of silicon microneedles fabricated by wet etch technology. Microelectron J 36:650–656
5. Sakwe SA, Muller R, Wellmann PJ (2006) Optimization of KOH etching parameters for quantitative defect recognition in n-and p-type doped SiC. J Cryst Growth 289:520–526
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