1. International Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose CA (1997).
2. Seidel, T. andZhao, B., “0.1 μm Interconnect Technology Challenges and the SIA Roadmap,”Proceedings of the 1996 MRS Spring Symposium,427,3–16 (1996).
3. Nix, W.D., “Mechanical-properties of Thin-films,”Metallurg. Trans. A,20,2217–2245 (1989).
4. Li, C.-Y., Totta, P., and Ho, P., eds., Stress Induced Phenomena in Metallization: First International Workshop, AIP Conference Proceedings,263 (1992).
5. Ho, P.S., Li, C.-Y., and Totta, P., eds., Stress Induced Phenomena in Metallization: Second International Workshop, AIP Conference Proceedings,305 (1993).