Performance analysis of air-cooled microchannel absorber in absorptionbased miniature electronics cooling system

Author:

Kim Yoon Jo,Joshi Yogendra K.,Fedorov Andrei G.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Reference20 articles.

1. International Technology Roadmap for Semiconductors, Assembly and Packaging, (2005) Ed.

2. R. Mongia, K. Masahiro, E. DiStefano, J. Barry, W. Chen, M. Izenson, F. Possamai, A. Zimmermann and M. Mochizuki, Small scale refrigeration system for electronics cooling within a notebook computer, Proc. Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, San Diego, CA, USA. (2006) 751–758.

3. M. K. Drost and M. Friedrich, Miniature heat pump for portable and distributed space conditioning applications, Proc. Thirty-Second Intersociety Energy Conversion Engineering Conference, Honolulu, Hawaii, USA, (1997) pt. 2, 1271–1274.

4. A. Beutler, F. Ziegler and G. Alefeld, Falling film absorption with solutions of a hydroxide mixture, International Absorption Heat Pump Conference, Montreal, Canada, (1996) 303–309.

5. J. D. Killion and S. Garimella, A critical review of models of coupled heat and mass transfer in falling film absorption, Int. J. Refrigeration 24 (2001) 755–797.

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