Thermal modelling and design of dynamically-controlled heater plates for high temperature processing of 300 mm wafers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-019-0939-0.pdf
Reference15 articles.
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2. H. T. Chua, A. Tay, Y. Wang and X. Wu, A heater plate assisted bake/chill system for photoresist processing in photolithography, Applied Thermal Engineering, 29 (2009) 985–997.
3. T.-K. Lim and S.-H. Rhi, Experimental study on nanofludic heat pipe hot chuck plate in semiconductor wafer baking process, Journal of Mechanical Science and Technology, 24 (7) (2010) 1501–1509.
4. Q. Zhang, K. Poolla and C. J. Spanos, Across wafer critical dimension uniformity enhancement through lithography and etch process sequence: Concept, approach, modeling, and experiment, IEEE Transactions on Semiconductor Manufacturing, 20(4) (2007) 488–505.
5. W. K. Ho, A. Tay and C. D. Schaper, Optimal predictive control with constraints for the processing of semiconductor wafers on bake plates, IEEE Transactions on Semiconductor Manufacturing, 13(1) (2000) 88–96.
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