Real-time detection of surface cracks on silicon wafers during laser beam irradiation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-014-1206-z.pdf
Reference20 articles.
1. S. H. Choi and K. Y. Jhang, Thermal damages on the surface of a silicon wafer induced by a near-infrared laser, Optical Engineering, 51 (1) (2014) 017103.
2. V. K. Arora and A. L. Dawar, Laser-induced damage studies in silicon and silicon-based photodetectors, Applied Optics, 35 (36) (1996) 7061–7065.
3. T. S. Gross, S. D. Hening and D. W. Watt, Crack formation during laser cutting of silicon, Journal of Applied Physics, 69 (2) (1991) 983–989.
4. L. E. Murr and W. A. Szilva, Laser-induced fracture in silicon, Journal of Materials Science, 10 (1975) 1536–1548.
5. J. Q. Lu, P. Yang and X. H. Hu, Simulation of light scattering from a biconcave red blood cell using the finitedifference time-domain method, Journal of Biomedical Optics, 10 (2) (2005) 024022.
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