Topology optimization for unifying deposit thickness in electroplating process-Reference-Cited by-同舟云学术

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Topology optimization for unifying deposit thickness in electroplating process

Published:2020-05-13 Issue:4 Volume:62 Page:1767-1785
ISSN:1615-147X
Container-title:Structural and Multidisciplinary Optimization
language:en
Short-container-title:Struct Multidisc Optim

Author:

Ishizuka Naoko,Yamada Takayuki,Izui Kazuhiro,Nishiwaki Shinji

Publisher

Springer Science and Business Media LLC

Subject

Control and Optimization,Computer Graphics and Computer-Aided Design,Computer Science Applications,Control and Systems Engineering,Software

Link

https://link.springer.com/content/pdf/10.1007/s00158-020-02574-8.pdf

Reference28 articles.

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2. Aoki S, Amaya K (1997) Optimization of cathodic protection system by BEM. Eng Anal Bound Elem 19(2):147–156. https://doi.org/10.1016/S0955-7997(97)00019-2. http://www.sciencedirect.com/science/article/pii/S0955799797000192. Optimization and Sensitivity Analysis

3. Bendsøe MP, Kikuchi N (1988) Generating optimal topologies in structural design using a homogenization method. Comput Methods Appl Mech Eng 71(2):197–224. https://doi.org/10.1016/0045-7825(88)90086-2. http://www.sciencedirect.com/science/article/pii/0045782588900862

4. Bendsøe MP, Sigmund O (1999) Material interpolation schemes in topology optimization. Arch Appl Mech 69(9):635–654. https://doi.org/10.1007/s004190050248

5. Blais M, Désilets M, Lacroix M (2013) Optimization of the cathode block shape of an aluminum electrolysis cell. Appl Thermal Eng 58(1):439–446. https://doi.org/10.1016/j.applthermaleng.2013.04.040. http://www.sciencedirect.com/science/article/pii/S1359431113003116

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