A comprehensive review of opportunities and challenges in heat pipe application: a numerical modeling
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,General Engineering,Aerospace Engineering,Automotive Engineering,Industrial and Manufacturing Engineering,Applied Mathematics
Link
https://link.springer.com/content/pdf/10.1007/s40430-023-04619-7.pdf
Reference100 articles.
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3. Zhao J, Rao Z, Liu C, Li Y (2016) Experimental investigation on thermal performance of phase change material coupled with closed-loop oscillating heat pipe (PCM/CLOHP) used in thermal management. Appl Thermal Eng 93:90–100
4. Ahammed N, Asirvatham LG, Wongwises S (2016) Thermoelectric cooling of electronic devices with nanofluid in a multiport minichannel heat exchanger. Exp Thermal Fluid Sci 74:81–90
5. Krishna J, Kishore PS, Solomon AB (2017) Heat pipe with nano enhanced-PCM for electronic cooling application. Exp Thermal Fluid Sci 81:84–92
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