Thermal Properties of Carbon Nanotube–Copper Composites for Thermal Management Applications-Reference-Cited by-同舟云学术

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Thermal Properties of Carbon Nanotube–Copper Composites for Thermal Management Applications

Published:2010-03-19 Issue:5 Volume:5 Page:868-874
ISSN:1931-7573
Container-title:Nanoscale Research Letters
language:en
Short-container-title:Nanoscale Res Lett

Author:

Chu Ke,Guo Hong,Jia Chengchang,Yin Fazhang,Zhang Ximin,Liang Xuebing,Chen Hui

Publisher

Springer Science and Business Media LLC

Subject

Condensed Matter Physics,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/s11671-010-9577-2

Reference35 articles.

1. S. Iijima, Nature 354, 56 (1991)

2. E.T. Thostenson, Z.F. Ren, T.W. Chou, Compos. Sci. Technol. 61, 1899 (2001)

3. R.H. Baughman, A.A. Zakhidov, W.A. de Heer, Science 297, 787 (2000)

4. M.J. Biercuk, M.C. Llaguno, M. Radosavljevic, J.K. Hyun, A.T. Johnson, Appl. Phys. Lett. 80, 2767 (2002)

5. C.H. Liu, H. Huang, Y. Wu, S.S. Fan, Appl. Phys. Lett. 84, 4248 (2004)

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