Chipping value prediction for dicing saw based on sparrow search algorithm and neural networks
Author:
Publisher
Springer Science and Business Media LLC
Subject
Hardware and Architecture,Information Systems,Theoretical Computer Science,Software
Link
https://link.springer.com/content/pdf/10.1007/s11227-023-05728-9.pdf
Reference68 articles.
1. Edler S, Schels A, Biba J, Hansch W, Bachmann M, Düsberg F, Werber M, Langer C, Meyer M, Bergen D et al (2021) Silicon field emitters fabricated by dicing-saw and wet-chemical-etching. J Vac Sci Technol B 39(1):027001
2. Wu J, Chen G, Chen F (2020) Positioning accuracy control of dual-axis dicing saw for machining semiconductor chip. Int J Adv Manuf Technol 109(7–8):2299–2310
3. Vagues M (2003) Analysing backside chipping issues of the die at wafer saw. Partial Fulfillment MatE 234:10–23
4. Zheng W, Luo Y, Chen Y, Wang X (2021) A simplified fractional order PID controller’s optimal tuning: a case study on a PMSM speed servo. Entropy 23(2):130
5. Tobon-Mejia DA, Medjaher K, Zerhouni N, Tripot G (2012) A data-driven failure prognostics method based on mixture of gaussians hidden Markov models. IEEE Trans Reliab 61(2):491–503
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