The Pb−Sn (Lead-Tin) system
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Physical and Theoretical Chemistry,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/BF02890552.pdf
Reference61 articles.
1. 1890Hey: C.T. Heycock and F.H. Neville, “The Molecular Weights of Metals when in Solution,”J. Chem. Soc., 57, 376–393, (1890). (Equi Diagram; Experimental)
2. 1892Hey: C.T. Heycock and F.H. Neville, “On the Lowering of the Freezing Points of Cadmium, Bismuth and Lead when Alloyed with Other Metals,”J. Chem. Soc., 61, 888–916 (1892). (Equi Diagram; Experimental)
3. 1894Wie: B. Wiesengrund,Wied. Ann., 52, 777 (1894); as cited in |09Deg|. (Equi Diagram; Experimental)
4. 01Cha: G. Charpy,Contr. Etud. Alliages (1901); as cited in |09Deg|. (Equi Diagram; Experimental)
5. 01Kap: A.W. Kapp,Ann. Phys. 6, 754 (1901); as cited in |09Deg|. (Equi Diagram; Experimental)
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