Funder
This work was supported by the Friterm Inc. R&D Laboratory.
Publisher
Springer Science and Business Media LLC
Reference37 articles.
1. Graef M, Huizing B, Mahnkopf R. System Integration: ITRS 2.0 View of the new Ecosystem. In: International Technology Roadmap for Semiconductors 2.0. Semiconductor Industry Association. 2015. https://www.semiconductors.org/wp-content/uploads/2018/06/0_2015-ITRS-2.0-Executive-Report-1.pdf. Accessed 09 Sep 2020.
2. Karayiannis TG, Mahmoud MM. Flow boiling in microchannels: fundamentals and applications. Appl Therm Eng. 2017;115:1372–97.
3. Gan T, Ming T, Fang W, Liu Y, Miao L, Ren K, Ahmadi MH. Heat transfer enhancement of a microchannel heat sink with the combination of impinging jets, dimples, and side outlets. J Therm Anal Calorim. 2020;141:45–56.
4. Muhammad A, Selvakumar D, Iranzo A, Sultan Q, Wu J. Comparison of pressure drop and heat transfer performance for liquid metal cooled mini-channel with different coolants and heat sink materials. J Therm Anal Calorim. 2020;141:289–300.
5. Rehman T, Ali HM. Thermal performance analysis of metallic foam-based heat sinks embedded with RT-54HC paraffin: an experimental investigation for electronic cooling. J Therm Anal Calorim. 2020;140:979–90.
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献