Thermal analysis via horizontal solidification of Al3Cu2Si (mass%) alloy: thermal and microstructural parameters, intermetallic compounds and microhardness-Reference-Cited by-同舟云学术

Thermal analysis via horizontal solidification of Al3Cu2Si (mass%) alloy: thermal and microstructural parameters, intermetallic compounds and microhardness

Published:2021-01-04 Issue:5 Volume:146 Page:2059-2071
ISSN:1388-6150
Container-title:Journal of Thermal Analysis and Calorimetry
language:en
Short-container-title:J Therm Anal Calorim

Author:

Costa Marlo O.,Barbosa Carolina R.,Azevedo Hugo M.,Machado Gabriel H.,Rocha Fernando S.,Moreira Antonio S.,Rocha Otávio L.^ORCID

Funder

CNPq

Capes

Federal Institute of Education, Science and Technology of Pará

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10973-020-10419-1.pdf

Reference51 articles.

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2. Gündüz M, Çadirli E. Directional solidification of aluminium–copper alloys. Mater Sci Eng A. 2002;327:167–85.

3. Çadırlı E. Effect of solidification parameters on mechanical properties of directionally solidified Al-Rich Al–Cu alloys. Met Mater Int. 2013;19:411–22.

4. Kaya H, Çadırlı E, Böyük U, Maraşli N. Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys. Appl Surf Sci. 2008;255:3071–8.

5. Rosa DM, Spinelli JE, Garcia A. Tertiary dendrite arm spacing during downward transient solidification of Al–Cu and Al–Si alloys. Mater Lett. 2006;60:1871–4.

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