Low-temperature reduction of silver(I) oxide particles with long chain alcohol
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Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/content/pdf/10.1007/s10973-013-3420-9.pdf
Reference21 articles.
1. Neudeck PG, Okojie RS, Chen Y. High-temperature electronics—a role for wide bandgap semiconductors. Proc IEEE. 2002;90:1065–76.
2. Cooper JA, Agarwal A. SiC power-switching devices-the second electronics revolution? Proc IEEE. 2002;90:956–68.
3. Bai JG, Lu GQ. Thermomechanical reliability of low-temperature sintered silver die-attached SiC power device assembly. IEEE Trans Device Mater Reliab. 2006;6:436–41.
4. Morita T, Ide E, Yasuda Y, Hirose A, Kobayashi KF. Study of bonding technology using silver nanoparticles. Jpn J Appl Phys. 2008;47:6615–22.
5. Ide E, Angata S, Hirose A, Kobayashi KF. Metal-metal bonding process using Ag metallo-organic nanoparticles. Acta Mater. 2005;53:2385–93.
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