Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/article/10.1007/s10853-017-1689-y/fulltext.html
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4. Li JF, Agyakwa PA, Johnson CM (2011) Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater 59:1198–1211
5. Bosco NS, Zok FW (2004) Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system. Acta Mater 52:2965–2972
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