Effects of zinc on the interfacial reactions of tin–indium solder joints with copper-Reference-Cited by-同舟云学术

Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

Published:2014-02-13 Issue:10 Volume:49 Page:3805-3815
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Lin Shih-Kang,Chang Ru-Bo,Chen Sinn-Wen,Tsai Ming-Yueh,Hsu Chia-Ming

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-014-8092-8.pdf

Reference22 articles.

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3. The Restriction of Hazardous Substances in Electrical and Electronic Equipment (ROHS), Official Journal of the European Union: L 37/19-L 37/23

4. Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mat Sci Eng R 27:95–141

5. Zeng K, Tu KN (2002) Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mat Sci Eng R 38:55–105

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