The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction-Reference-Cited by-同舟云学术

The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

Published:2012-08-28 Issue:2 Volume:48 Page:857-865
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Tseng Chien-Fu,Duh Jenq-Gong

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-012-6807-2.pdf

Reference34 articles.

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4. Ma H, Suhling JC (2009) J Mater Sci 44:1141. doi: 10.1007/s10853-008-3125-9

5. Tu KN, Zeng K (2001) Mater Sci Eng R 34:1. doi: 10.1016/S0927-796X(01)00029-8

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