Direct bonding of Cu to oxidized silicon nitride by wetting of molten Cu and Cu(O)
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-009-3951-4.pdf
Reference12 articles.
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4. Yi S, Trumble KP, Gaskell DR (1999) Acta Mater 47:3221
5. Schulz-Harder J (2003) Microelectron Reliab 43:359
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