The wettability and dissolution behaviour of gold in soft soldering-Reference-Cited by-同舟云学术

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The wettability and dissolution behaviour of gold in soft soldering

Published:1976-03 Issue:1 Volume:9 Page:7-11
ISSN:0017-1557
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Heinzel H.,Saeger K. E.

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/BF03215398

Reference19 articles.

1. A. Keil,Metalloberfläche, 1957,11, (10), 334

2. J. Sagoschen,Galvanotechnik Oberflächenschutz, 1959,2, 59

3. J. P. Fabish,Welding J., 1964,43, (July supp.), 400 S

4. D. G. Foulke, Prot. Corros. Metal Finish., Proc. Int. Conf. “Surface 66”. Basle, 1966, 103

5. R. G. Baker and T. A. Palumbo,Plating, 1971,58, (8), 791

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