Characterization of Transient Liquid-Phase Bonded Joints in a Copper-Beryllium Alloy with Silver-base Interlayer
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11665-011-9953-9.pdf
Reference10 articles.
1. N.P. Hung, Z.W. Zhong, K.K. Lee, and C.F. Chai, Precision Grinding and Facing of Copper-Beryllium Alloys, Precis. Eng., 1999, 23(4), p 293–304
2. W. Bonfield and B.C. Edwards, Precipitation Hardening in Cu 1.81 wt % Be 0.28 wt % Co, J. Mater. Sci., 1974, 9, p 398–408
3. S. Zalkind and D. Moreno, Fracture Characterization of Welded Copper Beryllium Alloy, J. Mater. Sci. Lett., 1999, 18, p 849–852
4. W.F. Gale and E.R. Wallach, Microstructural Development in Transient Liquid Phase Bonding, Metall. Trans. A, 1991, 22, p 2451–2457
5. N.S. Bosco and F.W. Zok, Critical Interlayer Thickness for Transient Liquid Phase Bonding in the Cu-Sn System, Acta Mater., 2004, 52(10), p 2965–2972
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