Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11665-022-06840-2.pdf
Reference20 articles.
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2. K. Hari Krishnan, S. John, K.N. Srinivasan, J. Praveen, M. Ganesan and P.M. Kavimani, An Overall Aspect of Electroless Ni-P Depositions—A Review Article, Metall. Mater. Trans. A, 2006, 37A, p 1917–1926. https://doi.org/10.1007/s11661-006-0134-7
3. Y. Yang, J.N. Balaraju, Y. Huang, H. Liu and Z. Chen, Interface Reaction Between an Electroless Ni–Co–P Metallization and Sn–3.5Ag Lead-Free Solder with Improved Joint Reliability, Acta Mater., 2014, 71, p 69–79. https://doi.org/10.1016/j.actamat.2014.02.026
4. J.N. Balaraju, Kalavati, N.T. Manikandanath and V.K. William Grips, Phase Transformation Behavior of Nanocrystalline Ni–W–P Alloys Containing Various W and P Contents, Surf. Coat. Technol., 2012, 206, p 2682–2689. https://doi.org/10.1016/j.surfcoat.2011.11.024
5. Y. Yang, J.N. Balaraju, S. Choong Chong, H. Xu, Ch. Liu, V.V. Silberschmidt and Z. Chen, Significantly Retarded Interfacial Reaction Between an Electroless Ni–W–P Metallization and Lead-Free Sn–3.5Ag Solder, J. Alloys Compd., 2013, 565, p 11–16. https://doi.org/10.1016/j.jallcom.2013.02.113
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