Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/article/10.1007/s11665-018-3390-y/fulltext.html
Reference23 articles.
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3. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu, Ductile-to-Brittle Transition in Sn-Zn Solder Joints Measured by Impact Test, Scr. Mater., 2004, 51(7), p 641–645
4. S.P. Yu, M.H. Hon, and M.-C. Wang, The Adhesion Strength of a Lead-Free Solder Hot-Dipped on Copper Substrate, J. Electron. Mater., 2000, 29(2), p 237–243
5. T. Laurila, V. Vuorinen, and J.K. Kivilahti, Interfacial Reactions Between Lead-Free Solders and Common Base Materials, Mater. Sci. Eng. R Rep., 2005, 49(1–2), p 1–60
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1. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times;Nanomaterials;2023-10-23
2. Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows;Journal of Materials Research and Technology;2023-09
3. A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints;Journal of Manufacturing Processes;2022-11
4. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow;Materials;2022-04-08
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