Trapped particle detection in bonded semiconductors using gray-field photoelastic imaging-Reference-Cited by-同舟云学术

Trapped particle detection in bonded semiconductors using gray-field photoelastic imaging

Published:2005-10 Issue:5 Volume:45 Page:457-466
ISSN:0014-4851
Container-title:Experimental Mechanics
language:en
Short-container-title:Experimental Mechanics

Author:

Horn G.,Mackin T. J.,Lesniak J.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF02427995.pdf

Reference34 articles.

1. Joch, A., “Silicon on Insulator,” Computerworld, December (2000).

2. Cristoloveanu, S. andCeller, G.K., “Frontiers of Silicon-oninsulator,” Journal of Applied Physics,93(9),4955–4978 (2003).

3. Maszara, W.P., Goetz, G., Caviglia, A., andMcKitterick, J.B., “Bonding of Silicon Wafers for Silicon-on-insulator,” Journal of Applied Physics,64(10),4943–4950 (1988).

4. International MEMS/MST/Top Down Nano Roadmap, http://www. mansef.org (2002).

5. Mirza, A.R., “Wafer-level Packaging Technology for MEMS,” Thermomechanical Phenomena in Electronic Systems — Proceedings of the Intersociety Conference, Las Vegas, NV, Vol.1,113–119 (2000).

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