1. Mulgaonker, S., Chambers, B., Mahalingam, M., Ganesan, G., Hause, V. and Berg, H., 1994, IEEE Transaction on Components, Packaging, and Manufacturing Technology-Part A, vol. 17, No. 4, pp. 573–581.
2. JEDEC Standard EIA/JESD51, Methodology for the Thermal Measurement of Component packages (Single Semiconductor Device), 1995.
3. JEDEC Standard EIA/JESD51-1, Integrated Circuits Thermal Measurement Method-Electrical Test Method (Single Semiconductor Device), 1995.
4. JEDEC Standard EIA/JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions-Natural Convection (Still Air), 1995.
5. JEDEC Standard EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements, 1995.