Numerical study on flow and heat transfer characteristics of microchannel designed using topological optimizations method

Author:

Hu DingHua,Zhang ZhiWei,Li Qiang

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Reference38 articles.

1. Mu Y T, Chen L, He Y L, et al. Numerical study on temperature uniformity in a novel mini-channel heat sink with different flow field configurations. Int J Heat Mass Transfer, 2015, 85: 147–157

2. Bailey C. Thermal management technologies for electronic packaging: Current capabilities and future challenges for modelling tools. In: Proceedings of the Electronics Packaging Technology Conference. New Jersey: IEEE, 2008

3. Sauciuc L, Chrysler G, Mahajan R, et al. Air-cooling extension-performance limits for processor cooling applications. In: Proceedings of the Ninteenth Annual IEEE, Semiconductor Thermal Measurement and Management Symposium. San Jose: IEEE, 2003

4. Pease R F W. IIIB-8 implications of high performance heat sinking for electron devices. IEEE Trans Electron Devices, 1981, 28: 1230–1231

5. Tilley B S. On microchannel shapes in liquid-cooled electronics applications. Int J Heat Mass Transfer, 2013, 62: 163–173

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