The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys-Reference-Cited by-同舟云学术

The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys

Published:1999-09 Issue:5 Volume:5 Page:477-484
ISSN:1225-9438
Container-title:Metals and Materials
language:en
Short-container-title:Metals and Materials

Author:

Kim Dae-Up,Kang Chung-Yun,Lee Won-Jae

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF03026162.pdf

Reference12 articles.

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2. H. Harada, T. Yamagata, S. Nakazawa, K. Ohno and M. Yamazaki,Proc. of Int. Conf. on High Temperature Alloys for Power Engineering 1990, p. 1319, AIME, Liege, Belgium (1990).

3. D. S. Duvall, W. A. Owczarski and D. F. Paulonis,Weld. J. 53, 203s (1974).

4. C. Kang,Ph. D. Thesis, Osaka University (1989).

5. Y. Nakao, K. Nishimoto, K. Shinozaki and C. Kang,Quartly J. of Jpn. Welding Society 6, 519 (1988).

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