Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints

Published:2019-02-26 Issue:3 Volume:63 Page:751-757
ISSN:0043-2288
Container-title:Welding in the World
language:en
Short-container-title:Weld World

Author:

Chen Jieshi,Yang Jin,Zhang Yongzhi,Yu Zhishui,Zhang Peilei

Funder

Young Scientists Fund

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/article/10.1007/s40194-019-00704-5/fulltext.html

Reference21 articles.

1. Baheti VA, Kashyap S, Kumar P, Chattopadhyay K, Paul A (2017) Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system. Acta Mater 131:260–270

2. Liashenko OY, Lay S, Hodaj F (2016) On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface. Acta Mater 117:216–227

3. Yang Y, Lu H, Yu C, Li Y (2011) Void formation at the interface in Sn/Cu solder joints. Microelectron Reliab 51(12):2314–2318

4. Buchovecky E, Jadhav N, Bower AF, Chason E (2009) Finite element modeling of stress evolution in Sn films due to growth of the Cu6Sn5 intermetallic compound. J Electron Mater 38(12):2676–2684

5. Yin L, Borgesen P (2011) On the root cause of Kirkendall voiding in Cu3Sn. J Mater Res 26(3):455–466

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage;Journal of Alloys and Compounds;2024-11

2. Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations;Journal of Materials Research and Technology;2024-05

3. Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints;Journal of Materials Science;2024-04-13

4. Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder;Electronic Materials Letters;2024-04-03

5. The differences in bonding properties and electrical, thermal conductivity between the preferred crystallographic orientation interface of Cu3Sn/Cu;Surfaces and Interfaces;2024-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3