Author:
Madeni J. C.,Liu S.,de Andrade P. H. S.,Carson C. H.
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference27 articles.
1. Humpston, G, Jacobson DM (1993) Principles of soldering and brazing, 1st Ed. ASM International
2. Harman AC (1978) “Rapid tin-nickel intermetallic growth: some effects of solderability”, Proceedings, InterNepcon. Brighton, U.K, p 92
3. Yu S, Wan M, Hon M Jan (2001) Formation of intermetallic compounds at Eutectic Sn-Zn-Al, solder/Cu interface. J Mater Res Vol. 16, No. 1
4. www.soselectronic.com/a_info/resource/pdf/ine/sac305.pdf (2014)
5. Zeng K, Tu KN (2002) Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater Sci Eng p. 55–105
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献