Microstructure and properties of a novel SnSbAgNi solder
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s40194-022-01453-8.pdf
Reference25 articles.
1. Zhang ZY, Chen JS, Wang JN et al (2022) Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps. Weld World 66:973–983
2. Yonekura D, Ueki T, Taguchi Y (2018) Application of ultrasonic assisted soldering method to hard-to-solder material. Int J Mod Phys B 32(19):1840054–1840058
3. Gain AK, Liangchi Zhang LC (2016) Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder. J Mater Sci: Mater Electron 27:781–794
4. Cheng SF, Huang CM, Pecht M (2017) A review of lead-free solders for electronics applications. Microelectron Reliab 75:77–95
5. Satizabal LM, Costa D, Moraes PB (2019) Microstructural array and solute content affecting electrochemical behavior of Sn Ag and Sn Bi alloys compared with a traditional Sn Pb alloy. Mater Chem Phys 223:410–425
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