Author:
Chiu Ming-Chuan,Teng Li-Wei
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference33 articles.
1. Chiu, M. C. and Okudan, G., “An investigation on the impact of product modularity level on supply chain performance metrics: An industrial case study,” Journal of Intelligent Manufacturing, pp. 1–17, 2012.
2. Hwang, S. C. and Choi, Y., “Modular design of a product to maximize customer satisfaction with respect to body size: A case study for designing office chair,” Int. J. Precis. Eng. Manuf., Vol. 12, No. 5, pp. 791–796, 2011.
3. Jose, A. and Tollenaere, M., “Modular and platform methods for product family design: Literature analysis,” Journal of Intelligent Manufacturing, Vol. 16, No. 3, pp. 371–390, 2005.
4. Gershenson, J. K., Prasad, G. J., and Zhang, Y., “Product modularity: Definitions and benefits,” Journal of Engineering Design, Vol. 14, No. 3, pp. 295–313, 2003.
5. Gershenson, J. K., Prasad, G. J., and Zhang, Y., “Product modularity: Measures and design methods,” Journal of Engineering Design, Vol. 15, No. 1, pp. 33–51, 2004.
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献