1. C.B. Cooper III and al, JES vol B4, n° 10.
2. Reactive ion etching of through the wafer via connections for contacts to AsGA FET’S.
3. R.T. Thomson and B.W. Whitacker, 32nd Elect. Comp. Conf. Proceedings San Diego 1982 Conductive via Processing utilizing RF Sputtering and Selective electroposition for Hybrid Thin Film Circuits.
4. J.P. Lazzari and P. Deroux-Dauphin, INTERMAG Fall Meeting, Washington (march 1989).
5. P. Deroux-Dauphin and H. Sibuet, 5th annual Head/Media Technology Review Comdex Las Vegas, november 12th 1989.