Author:
Lamb R. N.,Grunze M.,Baxter J.,Kong C. W.,Unertl W. N.
Publisher
Springer Berlin Heidelberg
Reference22 articles.
1. Polymer Materials for Electronic Applications, A.C.S. Symp. Ser., 184 (1982)
2. Y.-H. Kim, G. F. Walker, J. Kim and J. Park, J. Adhesion Sci. Tech. 1 331 (1987).
3. S. P. Kowalczyk, Y. H. Kim, G. F. Walker, J. Kim, Appl. Phys. Lett., 52, 375 (1988).
4. N. J. Chou and C. H. Tang, J. Vac. Sci. Technol. A, 2, 751 (1984).
5. J. L. Jordan, P.N. Sanda, J.F. Morar, C. A. Kovac, F. J. Himpsel and R. A. Pollak, J. Vac. Sci. Technol. A, 4, 1046 (1986)
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