Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system

Author:

Park Su-seong,Kim Jae-min,Chung Won-jee,Shin O.-chul

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,General Engineering

Reference8 articles.

1. KIM K H, OH S R, RHIM S S. Fiducial mark recognition algorithm and stage control for MLCC alignment [J]. Korean Society of Mechanical Engineers, 2008: 215–217.

2. SHIN O C, JUNG S R, JUNG S H, KIM S I, JUNG W J, KIM J M. Development of chip align automation system for second firing of multi-layer ceramic capacitor [J]. Korean Society of Manufacturing Process Engineers, 2009, 6: 225–228.

3. SONG C G, JO B G. MSC.ADAMS for multibody dynamics analysis [R]. 2007.

4. KIM W C, KIM J J, PARK B W, PARK S H, PARK T S, SONG M S, LEE S Y, LEE Y J, JEON J W, CHO S S. Introduction to Statistics [R]. 2005: 309–356.

5. MYERS R H, MONTGOMERY D C. Response surface methodology [M]. New York: John Wiley & Sons Inc, 1995: 77–112.

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