An experimental investigation of convective heat transfer enhancement in electronic module using curved deflector-Reference-Cited by-同舟云学术

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An experimental investigation of convective heat transfer enhancement in electronic module using curved deflector

Published:2016-07-21 Issue:3 Volume:53 Page:985-994
ISSN:0947-7411
Container-title:Heat and Mass Transfer
language:en
Short-container-title:Heat Mass Transfer

Author:

Rosas A. S.,Ali R. K.,Abdel-Aziz A. A.,Elshazly K. M.

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Link

http://link.springer.com/article/10.1007/s00231-016-1863-9/fulltext.html

Reference25 articles.

1. Rodgers P, Eveloy V, Pecht MG (2005) Limits of air-cooling: status and challenges. In: 21st IEEE Semi-Therm Symposium

2. Schmidt R (2004) Challenges in electronic cooling-opportunities for enhanced thermal management techniques-microprocessor liquid cooled mini-channel heat sink. Heat Transf Eng 25(3):3–12

3. Herman C, Kang E (2001) Comparative evaluation of three heat transfer enhancement strategies in a grooved channel. Heat Mass Transf 37:563–575

4. Young TJ, Vafai K (1998) Convective flow and heat transfer in a channel containing multiple heated obstacles. Int J Heat Mass Transf 41:3279–3298

5. McEntire AB, Webb BW (1990) Local forced convective heat transfer from protruding and flush-mounted two-dimensional discrete heat sources. Int J Heat Mass Transf 33(7):1521–1533

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