Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding-Reference-Cited by-同舟云学术

Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding

Published:1995-02 Issue:2 Volume:24 Page:107-113
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Shui Xiaoping,Chung D. D. L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02659630.pdf

Reference11 articles.

1. Mal Murthy, 4th Int. SAMPE Electronics Conference, Vol. 4,Electronic Materials—Our Future, eds. Ron W. Allred, Rob-ert J. Martinez and Ken B. Wischmann, 1990, p. 806.

2. Susan Ward, Anne Bolvari and Brian Gorry, 4th Int. SAMPE Electronics Conference, Vol. 4,Electronic Materials—Our Future, eds. Ron W. Albred, Robert J. Martinez and Ken B. Wischmann, 1990, p. 796.

3. D.S. Dixon and James V. Masi,SAMPE J. 25 (6), 31 (1989).

4. D.M. Bigg,Polym. Compos. 7 (2), 69 (1986).

5. D.M. Bigg,Adv. Polym. Technol. 4(3-4), 255 (1984).

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