Author:
Ismail Fatimah Sham,Yusof Rubiyah,Khalid Marzuki
Publisher
Springer Science and Business Media LLC
Subject
Artificial Intelligence,Industrial and Manufacturing Engineering,Software
Reference35 articles.
1. Ammous A., Sellami F., Ammous K., Morel H., Allard B., Chante J. P. (2003) Developing an equivalent thermal model for discrete semiconductor packages. International Journal of Thermal Science 42: 533–539
2. Bailey, C. (2003). Modelling the effect of temperature on product reliability, In 19th IEEE SEMI-THERM symposium, 324–330.
3. Bechtold T., Rudnyi E. B., Korvink J. G. (2005) Dynamic thermal simulation of microsystems. Journal of Micromechanics and Microengineering 15: 17–31
4. Chang P. C., Fan C. Y., Wang Y. W. (2009) Evolving CBR and data segmentation by SOM for flow time prediction in semiconductor manufacturing factory. Journal of Intelligent Manufacturing 20: 421–429
5. Coello C. A. C., Lamont G. B., Veldhuizen D. A. V. (2007) Evolutionary algorithms for solving multi-objective problems (2nd ed.). Springer, New York
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