Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys-Reference-Cited by-同舟云学术

Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys

Published:2002-11 Issue:11 Volume:31 Page:1190-1194
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Cook B. A.,Anderson I. E.,Harringa J. L.,Terpstra R. L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0009-7.pdf

Reference11 articles.

1. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly, p. 31 (May 2000).

2. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

3. I.E. Anderson, T.E. Bloomer, R.L. Terpstra, J.C. Foley, B.A. Cook, and J.L. Harringa (Paper presented at Proc. Int. Brazing and Soldering Conf. 2000, Albuquerque, NM, 2–5 April 2000).

4. I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, in this issue.

5. T.E. Bloomer (M.S. thesis, Iowa State University, 1999).

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